• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The present invention relates to a column lead type semiconductor package and a manufacturing method thereof, comprising: an insulator (30) having a through portion (41) in the center thereof; A plurality of lead bars (31) embedded in the insulator (30) and having horizontal legs (31a) and vertical legs (31b); A semiconductor chip (33) attached to the lower surface of the horizontal leg (31a) so as to be in contact with an upper edge by an adhesive (32), and having a plurality of pads (33a) in the upper center; A wire 35 connecting the pad 33a to a predetermined portion of the upper surface of the lead bar 31; An upper cover 36 covering the wire 35 and the upper surface of the semiconductor chip 33 is provided. According to the column lead type semiconductor package of the present invention, there is an effect that a center pad type semiconductor chip with a high degree of design freedom can be manufactured into a culture lead type semiconductor package with high package reliability.
    公开号:KR19990086917A
    申请号:KR1019980020099
    申请日:1998-05-30
    公开日:1999-12-15
    发明作者:이주화
    申请人:김영환；현대반도체 주식회사；
    IPC主号:
    专利说明:

    Column lead type semiconductor package and manufacturing method thereof
    BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor package, and more particularly, to a column lead type semiconductor package suitable for packaging a center pad type semiconductor chip having a pad in the center of the semiconductor chip, and a manufacturing method thereof.
    The column lead type semiconductor package is conventionally used for its advantages of having a strong resistance to physical shocks from the outside, such as the fact that external leads are embedded in the insulator, such that there is no warpage of the external leads. Such a column lead type semiconductor package will be described with reference to FIG. 1.
    1 is a longitudinal sectional view of a conventional column lead type semiconductor package. A top view of a conventional column lead type semiconductor package corresponding to the longitudinal cross-sectional view of FIG. 1 is shown in FIG. 2D. The structure of a conventional column lead semiconductor package will be described with reference to FIGS. 1 and 2D. It consists of the insulator 10 obtained using the molding compound, and the lead bar 11 embedded in the insulator 10 and exposed to the upper and lower surfaces and the outer peripheral surface of the insulator 10. The semiconductor chip 12 is attached to the upper surface of the bottom of the insulator 10 via a polyimide adhesive. A plurality of bonding pads (not shown) are formed on the upper surface of the semiconductor chip 12. The pad and a predetermined portion of the upper surface of the lead bar 11 are connected by a wire 13. The wire 14 and the semiconductor chip 12 are enclosed by a lid 14 made of a molding compound.
    As described above, the conventional column lead type semiconductor chip package is manufactured by the following process.
    First, as shown in FIG. 2A, a substrate for a semiconductor package in which a plurality of lead bars 11 are embedded in an insulator 10 is manufactured. The lead bars 11 are exposed to the upper and lower surfaces and the outer circumferential surface of the insulator. In a general method for manufacturing a substrate for a semiconductor package as described above, the conductive thin metal plate to be a lead bar is placed in a mold while supporting a predetermined support member, and a liquid molding compound is filled in the mold. After hardening the compound, removing the mold, and then slicing thinly the structure in the mold, the process is sequentially performed.
    Next, as shown in FIG. 2B, the recess 12a is formed by grinding the center portion of the semiconductor package substrate of FIG. 1.
    Next, as shown in FIG. 2C, the semiconductor chip 12 is attached to the recess 12a, and a pad (not shown) formed at an edge of the semiconductor chip 12 and a predetermined portion of the upper surface of the lead bar 11 are formed. To wire 13.
    Next, as shown in FIG. 2D, the wire 13, the recess 12a, and the semiconductor chip 12 are wrapped with a lid 14 made of a molding compound.
    A semiconductor chip in which a pad on a semiconductor chip connected to a lead bar by a wire is formed in the center of the semiconductor chip is called a center pad type semiconductor chip. The center pad type semiconductor chip increases the design freedom of the semiconductor chip since the pad may be located at the center of the semiconductor chip.
    However, the above-described conventional columnar semiconductor package has a problem that is difficult to apply to the packaging of such a center pad semiconductor chip. In other words, when the pad is formed at the center of the semiconductor chip, the distance between the pad and the lead bar is too long, which causes a problem in that the wiring process is not easy.
    Accordingly, an object of the present invention is to provide a column lead type semiconductor package and a method of manufacturing the same that can be applied to a center pad type semiconductor chip with high design freedom.
    In order to achieve the above object, a column-type semiconductor package according to the present invention includes a frame-type insulator having a penetrating portion at its center, and / or is embedded in both sides of the penetrating portion so as to be exposed only to upper and lower surfaces of the insulator. A semiconductor package substrate having a plurality of lead bars having a "a" shape having vertical legs extending downward from one end of the horizontal legs; A semiconductor chip having an upper edge portion attached to a lower surface of the horizontal leg of the lead bar, the semiconductor chip having a plurality of pads at a central portion of the upper surface of the lead bar; A plurality of wires connecting predetermined portions of the upper surface of the horizontal legs of the respective pads and the lead bars; The top cover which covers the said wire, the said pad, and the upper surface of the said semiconductor chip is provided.
    In order to achieve the object of the present invention, a method for manufacturing a column lead type semiconductor package includes a frame insulator having a penetrating portion in the center and two outer peripheral surfaces embedded in both sides of the penetrating portion and at one end of the horizontal leg and the horizontal leg. Manufacturing a substrate for a semiconductor package having a plurality of " a " shaped lead bars having vertical legs extending downward; Attaching a semiconductor chip to a lower surface of the horizontal leg such that an upper edge portion of the semiconductor chip having a plurality of pads is in contact with an upper center portion thereof; Connecting a predetermined portion of the upper surface of the pad and the lead bar with a wire; And covering the wire and the upper surface of the semiconductor chip with an upper cover.
    A method of manufacturing a column lead type semiconductor package for achieving the object of the present invention includes the steps of placing a plurality of metal bars in a mold, the step of putting an epoxy resin in the mold to cure the column, and the column Forming a penetrating portion in the central portion, cutting the column to a predetermined thickness to produce a unit column, and forming a recess in the inside of the unit column, and as a result, the metal bar is formed into a "a" shaped lead bar. Manufacturing a substrate for a semiconductor package, which is deformed; Attaching the semiconductor chip to the lower surface of the horizontal leg of the lead bar such that the upper edge of the semiconductor chip having a plurality of pads is in contact with the upper center portion; Connecting a predetermined portion of the upper surface of the pad and the lead with a wire; And covering the wire and the upper surface of the semiconductor chip with an upper cover.
    1 is a longitudinal cross-sectional view showing the structure of a conventional semiconductor package.
    2A to 2D are diagrams for describing a method of manufacturing a conventional semiconductor package.
    3 is a longitudinal sectional view showing the structure of the semiconductor package of the present invention.
    4A to 4H are longitudinal cross-sectional views illustrating a method of manufacturing a semiconductor package of the present invention.
    ** Explanation of symbols for main parts of drawings **
    10: insulator 11: lead bar
    12a: recess 12: semiconductor chip
    13: wire 14: cover
    100: substrate for semiconductor package
    30: insulator 31: lead bar
    31a: Horizontal leg of lead bar 31b: Vertical leg of lead bar
    32: adhesive 33: semiconductor chip
    33a: pad 34: lower cover
    35: wire 36: top cover
    40: column 41: penetration part
    42: unit column 44: recess
    Hereinafter, the structure of the column lead semiconductor package according to the present invention will be described with reference to FIG. 3.
    First, both sides of the outer circumferential surface are embedded in the frame-shaped insulator 30 having a penetrating portion in the center thereof, and the upper and lower surfaces of the semiconductor package substrate 100 including the lead bars 31 exposed to the upper and lower surfaces of the insulator 30. ) Is shown. The lead bar 31 has a shape of “a”, and includes a horizontal leg 31a extending in a horizontal direction and a vertical leg 31b extending in a vertical direction from one edge of the horizontal leg 31a. have. The lead bars 31 are arranged such that the “a” shaped lead bars 31 face each other on both sides of the center of the package substrate 100. The lead bars 31 on both sides are spaced apart from each other at the center of the package substrate.
    An upper surface of the semiconductor chip 33 is attached to the lower surface of the horizontal legs 31a of the lead bars 31 by an adhesive 32. A plurality of pads 33a are formed at the central portion of the upper surface of the semiconductor chip 33. The plurality of pads 33a are positioned at spaced positions of the two lead bars 31.
    The pads 33a and the lead bars 31 are connected to each other by wires 35 corresponding to each other. In other words, the wires 35 connect the pads 33a and predetermined portions of the horizontal legs 31a of the lead bars 31, respectively.
    Meanwhile, the molding compound fills the inner space of the vertical leg 31b formed by the vertical legs 31b of the lead bars 31 on both sides, and the portion filled by the molding compound is called the lower cover 34. . Both the bottom and side surfaces of the semiconductor chip 33 are wrapped by the lower cover 34.
    On the other hand, the upper part of the semiconductor chip 33, the pads 33a and the wires 35 are also surrounded by a molding compound, and the molding compound on the upper part of the semiconductor chip 33 is called an upper cover 36.
    A method of manufacturing the column lead type semiconductor package of the present invention shown in FIG. 3 is as follows.
    First, the column 40 is formed as shown in FIG. 4A, and the unit column 42 is formed by cutting the column 40 to a thickness suitable for packaging.
    The unit column 42 is formed in the following manner. First, a plurality of lead bar metal bars are placed in a mold, and the polyimide epoxy resin is filled into the mold to cure, and then the mold is removed to complete the column 40.
    Next, a penetrating portion 41 is formed in the center portion of the column 40. Next, the column 40 is cut to a suitable thickness.
    Next, as shown in FIG. 4B, a recess 44 is formed on one surface of the unit column 42 manufactured as shown in FIG. 4A to a size where the semiconductor chip chip may be seated. The recess 44 can generally be obtained by carrying out a grinding process. The top view corresponding to the structure of FIG. 4B is the same as that of FIG. 4C. The inside of the dotted line in the figure is the recess 44 area. 4B and 4C are referred to as a semiconductor package substrate 100 for manufacturing the column lead type semiconductor package of the present invention. The substrate 100 for a semiconductor package shown in FIG. 4B is a state in which the semiconductor package substrate 100 shown in FIG. 3 is shown upside down, showing a columnar semiconductor package of the present invention.
    The semiconductor package substrate 100 includes an insulator 30 and a lead bar 31. The lead bar 31 is composed of a horizontal leg 31a and a vertical leg 31b.
    Next, the adhesive 32 is applied to one side of the horizontal leg of the lead bar 31 as shown in FIG.
    Next, a plan view corresponding to the structure of FIG. 4D is as shown in FIG. 4E. In Fig. 4E, the hatched portion is the portion where the adhesive is applied.
    Next, as shown in FIG. 4F, the semiconductor chip 33 is attached to the adhesive 32. In this case, the upper surface of the semiconductor chip 33 is bonded to the adhesive 32. Here, the upper surface of the semiconductor chip 33 refers to the surface on which the pad 33a is formed. In this case, the pad 33a is exposed through spaced portions, that is, the penetrating portion 41 of both horizontal legs 31a of the lead bars 31. Next, the lower cover 34 is formed by filling the inside of both vertical legs 31b of the lead bars 31 with the molding compound so as to surround the lower surface of the semiconductor chip 33.
    Next, the structure of FIG. 4F is turned upside down as shown in FIG. 4G, and then a predetermined portion of one surface of the horizontal leg 31a of the pads 33a and the metal bars 31 corresponding thereto is connected to the wire 35. We perform wiring process to connect.
    Next, as shown in Figure 4h, by forming a top cover 36 by using a molding process to cover the upper surface of the pad 33a, the wire 35, the semiconductor chip 33, the column lead semiconductor package of the present invention Can be prepared.
    The column lead type semiconductor package of the present invention as described above has an effect that can be applied to a center pad type semiconductor chip with high design freedom. Therefore, by providing the column lead type semiconductor package structure and manufacturing method according to the present invention, there is an effect of increasing the market competitiveness of the column lead type semiconductor package manufactured according to the present invention.
    权利要求:
    Claims (4)
    [1" claim-type="Currently amended] Frame-shaped insulator 30 having a penetrating portion in the center, and / buried in both sides of the penetrating portion insulator 30 so as to be exposed only to the upper and lower surfaces of the insulator 30, the horizontal leg 31a and the horizontal leg 31a A semiconductor package substrate having a plurality of lead bars 31 having an "a" shape having vertical legs 31b extending downward from one end of the substrate; A semiconductor chip having a top edge portion contacted with a bottom surface of the horizontal leg 31a of the lead bar 31 and having a plurality of pads 33a at the center of the top surface; A plurality of wires 35 connecting the pads 33a and predetermined portions of the upper surface of the horizontal legs 31a of the lead bars 31; And a top cover (36) covering said wire (35), said pad (33a), and an upper surface of said semiconductor chip (33).
    [2" claim-type="Currently amended] The column lead type semiconductor package according to claim 1, further comprising a lower cover (34) covering a lower surface of said semiconductor chip (33).
    [3" claim-type="Currently amended] A frame-shaped insulator 30 having a penetrating portion 41 in the center, and both outer peripheral surfaces thereof are embedded in the insulator 30 on both sides of the penetrating portion 41 and extend downward from one end of the horizontal leg 31a and the horizontal leg. Manufacturing a semiconductor package substrate (100) having a plurality of " a " shaped leads (31) having vertical legs (31b); Attaching a semiconductor chip (33) to a lower surface of the horizontal leg (31a) such that an upper edge portion of the semiconductor chip (33) having a plurality of pads (33a) is in contact with a central portion of the upper surface (31a); Connecting the pad (33a) and a predetermined portion of the upper surface of the lid (31) with a wire (35); And a step of wrapping the upper part of the wire (35), the pad (33a) and the semiconductor chip (33) with the upper cover (36) by using a molding method.
    [4" claim-type="Currently amended] The method of claim 3, wherein the manufacturing of the semiconductor package substrate comprises: placing a plurality of metal bars in a mold; A step of manufacturing a column 40 by putting an epoxy resin in the molding die and curing; Forming a through portion (41) in the center of the column; Cutting the column (40) to a predetermined thickness to produce a unit column (42); And forming a recess 44 inside the unit column 42 by using a grinding method, and as a result, the metal bar is transformed into a "a" shaped lead bar. .
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    同族专利:
    公开号 | 公开日
    US6146918A|2000-11-14|
    KR100271657B1|2000-11-15|
    JP3072515B2|2000-07-31|
    JP2000012725A|2000-01-14|
    US6525411B1|2003-02-25|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    法律状态:
    1998-05-30|Application filed by 김영환, 현대반도체 주식회사
    1998-05-30|Priority to KR1019980020099A
    1999-12-15|Publication of KR19990086917A
    2000-11-15|Application granted
    2000-11-15|Publication of KR100271657B1
    优先权:
    申请号 | 申请日 | 专利标题
    KR1019980020099A|KR100271657B1|1998-05-30|1998-05-30|Column lead package and manufacturing method thereof|
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